SEMICONDUCTOR INSPECTION AND MARKING EQUIPMENT

WIND – Wafer Inspection

Wafer Macro Inspection

• High throughput with dual lens system
• Chip inspection after sawing
• Kerf inspection
• Advanced D2D algorithm using golden die extracted from neighboring 4 dies
• Verifying review module included
• Self-developed lens for wide field of view and good resolution
• Real time auto focusing module adopted
• Optional IR inspection to inspect defects, cracks and chippings inside silicon.

SUN – Mask Inspection
Reticle Macro Inspection

• Particle inspection on all area of reticle:  – Pellicle, Pellicle Frame, Pattern, Backside
• Multi scanning with vertical and oblique optical system
• Inspection of various reticles with 1 recipe:
• No prior work for each mask needed
• Applicable to full automation
• 0.5um pinhole/particle detection in non-pattern area
• Optional function to distinguish particle position at top/bottom of pellicle
• Verifying review module included

CYPRESS – Advanced Packaging Inspection
Die attach Inspection

• 2D inspection with good resolution
• 3D height measurement of the attached components
• Multiple handling of various types of packaging
• JEDEC tray, SUS tray, strip, etc.
• IR optics for inspection through silicon
• Optional stage heating
• IR Inspection

LMS-5000/1000 – Laser Markers

• IC Package Substrate Reject Marking /  2D Barcode & Serial No. Marking SysteM
• Reject, 2D barcode and Serial Number Marking at once on Standard Machine.
• Available for Electrolysis / Electroless / OSP Plating Products with ATI Specialized Marking Illumination.
• High Marking Accuracy with 10um Resolution which is the Highest Resolution of Laser Marking Machine.
• Able to Apply CO₂, Green and UV Laser Depends on Customer Request.
• Marking Accuracy : ±50um
• Interleaf Handling Function (Optional)
• Sorting Function (Optional)
• 500 Wafer Laser Marking
• 1000 Packaging/PCB Laser Marker