NDC International is your source for a complete line of die attach and die sorting systems.

Various die attach systems, capable of small die applications (LED die) through large die and flip chip processes, are offered. Sorting systems are available with capabilities including wafer level input with output to waffle pack, tape and reel, canister, JEDEC, etc.

We offer the following die attach / die sort systems from HANMI Semiconductor:

FEATURES

High Productivity: Typically 10,000 UPH\

Pick & Place Head with Theta-Compensation

Wafer Cassette Handler

• Wafer Handling:
• Programmable wafer stretch
• Die ejection
  • Servo controlled Z (synchronous with pick head)
  • Ejector correction of +/- 5mm for fine correction

Automatic Die Pick-Up & Mounting Height Verification & Compensation

• Voice coil motor for Z

Pick & Place Force Programmable Via Voice Coil Motor

Waffle Pak/GEL Pak Handling System (2-4″, or custom spec.)

• Stack at input
• Stack at output

Advanced Vision Inspection with High-Resolution Cameras

• Vision engine – HANMI vision system
  • All parameters can be saved
• Camera resolution: 640 x 480
• Lens zoom: x0.4 ~ 0.6 (manual zoom)
• FOV: 3 ~ 12mm
• Illumination: Coaxial (RGB) + Size (RGB)
  • Light controller adjustable via screen

Quick & Easy Conversion (10 min. maximum)

Low Cost of Ownership

FEATURES

High Productivity: 21,000 UPH (dry running speed only)

• Dual epoxy writing head
• Single die bonding head

Die Bonding Head with Theta-Compensation

Automatic Die Pick-Up & Mounting Height Checking with Compensation

Modular Concept for Inline Bonding

Advanced Vision Inspection with High-Resolution Cameras

Low Cost of Ownership

Quick & Easy Conversion

FEATURES

Productivity: 10,000 UPH (dry running), 5,000 (real production)

High Accuracy: ± 7.0 microns @ 3σ (normal), ± 10.0 microns @ 3σ (pre-aligned)

Programmable Bonding Force: 1N ~ 25N

Die Size: 0.5 mm ~ 30.0 mm

Wafer Size: Up to 12″

The Most Advanced X-Y-Z Motion Controlled Bonding Head

Dual Flipper & Bond Head for High Mass Production

Precise Pick Up & Bonding Process Utilizing Vision Inspection

Improved Machine Productivity

SMEMA In-Line Capability

.

FEATURES

Productivity: 15,000 UPH (dry running), 5,000 (real production)

High Accuracy: ± 5.0 microns @ 3σ (normal), ± 10.0 microns @ 3σ (pre-aligned)

Programmable Bonding Force: 1N ~ 25N

Die Size: 0.5 mm ~ 30.0 mm

Wafer Size: Up to 12″

The Most Advanced X-Y-Z Motion Controlled Bonding Head

Dual Flipper & Bond Head for High Mass Production

Precise Pick Up & Bonding Process Utilizing Vision Inspection

Improved Machine Productivity

SMEMA In-Line Capability

Mass Defect Protection Capability

.

FEATURES

High Productivity

• 15,000 UPH (Based on Dry Run)

Precision Bonding Capability

High Reliability

Precision Bonding Capability

High Reliability

• One Casting Body Structure

Low Cost of Ownership

• Economic Version of Flip Chip Bonder

.