NDC International represents the MPP (Micro Point Pro LTD) line of manual wire bonders in the USA, Mexico and Canada.
The long time leader in wire bonding technology, K&S recently sold the Manual Wire Bond business unit to MPP. The newest line is the iBond5000 Series and is based on the 4500 Series which was a market leader for over a decade.
We offer the following manual wire bonders from MPP:
FEATURES
Provides the High Yields and Excellent Repeatability Needed for All Gold Ball Bonding Applications Including:
Semi-Automatic/Manual Mode with ‘Z’ Option
‘Z’ Axis DC Servo Motion with Closed-Loop Control
Consistent Ball Size Via Negative Electronic Flame-Off
Missing Ball Detection & Auto-Stop
Deep Access Capability
Built-In Temperature Controller
Various Microscope and Spotlight Targeting Options Available
Large 6” x 6” Bonding Area
Variety of Wire Types: Gold & Copper (with copper kit option)
Chessman/Mouse & Manual ‘Z’ Convertible Right or Left
Ball Bonding, Bumping, Coining, Security Bond & Tab
FEATURES
Provides the High Yield and Excellent Repeatability Needed for Every Wedge Bonding Application Including:
Built-In Temperature Controller
Semi-Automatic/Manual Mode with ‘Z’ Option
Designed for Aluminum Wire, Gold Wire, Ribbon & Copper
Large 5.3” x 5.3” Bonding Area
Deep Access Capability (optional)
‘Z’ Axis DC Servo Motion with Closed-Loop Control
Wide Range of Microscopes and Optical Accessories Available
RoHS Compliant
Chessman/Mouse & Manual ‘Z’ Convertible Right or Left
Bonding Types: Wedge, Tab, Stitch & Ribbon
FEATURES
One Machine, Dual Function Capabilities
Provides the High Yield and Excellent Repeatability Needed for Every
Wedge Bonding Application
Wedge-Wedge and Ball-Wedge Bonding on the Same Machine
Semi-Automatic/Manual Mode with ‘Z’ Option
Fast Changeover by Operator with No Tools
Special K&S Proprietary Transducer for Proper Bond Tool Mounting
Ball Bonding Capillary Mounts with Split Clamp
90-Degree Deep Access Wedge Bonding with 12.5 mm ‘Z’ Axis Travel
Ball Bonding with 12.5 mm ‘Z’ Axis Travel
High-End Negative EFO with Missing Ball Detection
High-Q 60kHz Ultrasonic Transducer, optional 120kHz
2 Channel Independent Bonding Parameters
Built-In Digital Work Stage Temperature Control
