(800) 910-8150 or (215) 355-2460
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for Your Manufacturing Needs Cost-Effective Solutions from Systems to Service Your One-Stop Resource Packaging Solutions Turnkey Semiconductor

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About Us

NDC International (NDCI) can help you build the manufacturing capacity you need for future growth using one central resource. NDCI is a company with a new approach to offering turnkey solutions for our clients. Learn More.

Our Products

NDC International has served companies like you – in the business of manufacturing electronic equipment – since 2003. We are distributors of manufacturing equipment for semiconductor packaging, handling and assembly. Learn more.

Two New Products Hit Big at IMAPS 2016

NDC International and Neu Dynamics Corporation recently attended the 49th Annual International Symposium on Microelectronics in Pasadena, California on October 11th and 12th, 2016. The show was very successful… Read More

Featured Products

Boschman Advanced Packaging
Pink Plasma Cleaning System
ATI Wafer Inspection

Latest News

Boschman Technologies – Enabling Revolutionary Solutions

Neu Dynamics represents Boschman Advanced Packaging Technology in the Eastern United States. Boschman has been at the forefront of sintering technologies since 2014 when they introduced the groundbreaking Sinterstar Innovate-F-XL.  The company is based in the Netherlands and specializes in advanced transfer molding and sintering systems for the electronic assembly industry. They provide leading-edge encapsulation…
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Simple Solutions for Your Complex Die Attach Applications

MicroAssembly Technologies, Ltd. (MAT) was founded in 2000. With 35 years of experience, the folks at MAT deliver simple, flexible, high-value solutions for die attach. Because they focus exclusively on die attach technologies, they are at the top of that game offering machines with unmatched versatility and lowest cost of ownership. NDC represents MicroAssembly Technologies,…
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HANMI Launches New Jig Saw Model 6.0 GRIFFIN

In September, HANMI Semiconductor announced the launch of the 7th generation new micro SAW P2101 & VISION PLACEMENT 6.0 GRIFFIN. This system and their TC BONDER are essential equipment for artificial intelligence semiconductor HBM. HANMI has been leading the way in these technologies and announced last month that they posted their best quarter in sales…
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