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HANMI Launches New Jig Saw Model 6.0 GRIFFIN

In September, HANMI Semiconductor announced the launch of the 7th generation new micro SAW P2101 & VISION PLACEMENT 6.0 GRIFFIN. This system and their TC BONDER are essential equipment for artificial intelligence semiconductor HBM. HANMI has been leading the way in these technologies and announced last month that they posted their best quarter in sales…
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Next Gen Vacuum Soldering + Sintering from Budatec

At the iMAPS show in Boston earlier this month, we had huge interest in budatec’s systems from power module manufacturers. Their systems are the new gold standard, having won 80% of worldwide market share. Budatec has 30 years of experience and offers vacuum soldering and sintering systems ranging from small R&D to fully automated systems.…
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Neu Dynamics Establishes Partnership with Diamond Fund Partners

Philadelphia, PA, October 25, 2024 – Neu Dynamics Corporation and NDC International (collectively “Neu Dynamics”) are pleased to announce their partnership with Warren Capital Partners, LLC (“Warren Capital”) and Diamond Fund Partners, LLC (“DFP”). Strategic Exit Advisors (SEA) of Ambler, PA represented Neu Dynamics and facilitated the process. “We have known Kevin and his team…
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Neu Dynamics Corp. Appoints Nicholas Leonardi to Business Development Role

Philadelphia, PA, September 23, 2024 – Neu Dynamics Corp. (NDC) is pleased to announce the appointment of Nicholas Leonardi to a newly defined role in Business Development.  With over 30 years of experience in industries ranging from new product development and applications engineering to sales and marketing management, Mr. Leonardi brings a wealth of expertise…
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Meet Boschman at the Battery Show

Are you attending The Battery Show North America in October? If so, we invite you to stop by Booth #2550 where Neu Dynamics will be exhibiting along with Boschman Technologies. Boschman specializes in advanced transfer molding and sintering systems. Recently we announced the launch of their Sinterstar Mini – the latest addition to their powerful…
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Meet Powertrim Technologies

Leading the Way in Trim & Form Systems for Power Modules In June of 2024, Trim Form Automation (TFA) Europe and Include Industries launched a new semiconductor back-end equipment company called Powertrim Technologies. The company grew out of Tooling Specialist Derksen (TSD) – a respected supplier of precision mechanical parts and tools with over 20…
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Powerful Vacuum Soldering Systems from Budatec

If you are in the market for a vacuum soldering system, don’t miss the opportunity to meet budatec at the iMAPS show in Boston starting October 3rd. Budatec GmbH is a technology leader serving the semiconductor, photovoltaic, automotive and medical industries worldwide.  Based in Berlin, budatec has 30 years of experience and offers vacuum soldering…
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ESTEK Group – Performance & Quality

NDC International is pleased to announce that we are partnering with ESTEK Group to distribute their CMOS Imaging Sensor Inspection System, as well as their Die Sorter in North America. ESTEK was founded in 2015 and offers advanced optical inspection for the semiconductor industry.  Based in Malasia, they are an innovative vision and handling system…
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New Test Handlers from FA Systems

We are pleased to announce that FA Systems Automation (FASA) has expanded their test handler line! Known for their reliability and performance, the FASA test handlers now include 2 new models for a total of 8 systems to meet your needs. NDC International is proud to represent FASA – a company that has been empowering…
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Sinterstar Mini – Fast, Flexible & Practical

Our partner Boschman has long led the way in sintering technology and continues to be a supplier of top choice whether you engage in small batch or large-scale production. We are pleased to feature the new launch of their innovative Sinterstar Mini.  This system is unique, versatile and ideal for R&D and prototyping. It offers…
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