Neu Dynamics represents Boschman Advanced Packaging Technology in the Eastern United States. Boschman has been at the forefront of sintering technologies since 2014 when they introduced the groundbreaking Sinterstar Innovate-F-XL. The company is based in the Netherlands and specializes in advanced transfer molding and sintering systems for the electronic assembly industry.
They provide leading-edge encapsulation and bonding process equipment for a broad array of packages. Boschman serves companies from the automotive, medical, avionics, mobile, and industrial and renewables sectors worldwide.
Boschman’s 4 Core Technologies
Whether MEMS and Sensors, High-Power Modules and Packages, Optical Packages, 2.5/3D packages or Smart Cards, Boschman’s goal is to deliver smaller, better and lower cost packaging solutions for your products. To this end, the company leverages 4 core technologies.
Ag Sintering: Delivering High Yield & High Reliability
As electronic devices continue to become smaller and operate at higher power densities and temperatures, new approaches in manufacturing are required to ensure performance. Boschman’s sintering technologies address this need offering void-free, strong bonding with high thermal and electrical conductivity. In comparison to traditional solder methods, sinter bonding improves both the performance and longevity of devices. It can decrease the junction temperature (Tj) of your device up to 100℃. In the properly managed sinter process, the silver material changes in form from powder to a solid structure resulting in a more reliable bond.
Boschman’s silver sintering solutions fall into two categories:
- For low-volume production, R&D and prototyping they offer the semi-automatic Sinterstar Innovate series, as well as the new Sinterstar Mini.
- The Sinterstar Auto and Inline series address the need for medium-volume and high-volume production.
Film Assisted Molding (FAM): Improving Package Quality
Film Assisted Molding (FAM) is a modified transfer molding process in which one or two films are vacuumed down into the inner surface of the mold before the products are loaded. It works in conjunction with Boschman’s Dynamic Insert Technology (see below) to reliably produce unique package designs that could not otherwise be created. For example, packages with very small areas or very large, exposed areas. This opens up exciting possibilities for EMS, Sensors, medical, optical and power devices. Boschman’s proprietary Film Assisted Molding technology results in improved package quality.
The Film Assisted Molding solutions from Boschman include:
- For R&D, prototyping and low-volume production they offer the semi-automatic, Unistar Innovate series.
- The Unistar Auto series was developed for efficient, high-quality, medium to high-volume production.
Dynamic Insert Technology (DIT): Increasing Reliability
Boschman’s patented Dynamic Insert Technology (DIT) takes FAM one step further. It was developed to enhance the performance of FAM to automatically and dynamically control pressure on one or multiple surfaces. It simultaneously adjusts for height differences and tilt (compensating most of the tolerances), allowing windows to be created through transfer molding package encapsulation. This is critical for EG sensors, MEMS, power, optical and medical devices.
Through Polymer Via (TPV): Expanding What’s Possible
Through Polymer Via (TPV) is a patented technology to create high-density high-aspect ratio electrical and/or optical inter-connections through (transfer-molding) package encapsulation. By leveraging back-end lithography, Film Assisted Molding and Dynamic Insert Technology, TPV structures can be encapsulated while maintaining a perfectly clean top surface, allowing their use in mechanical, optical and electrical applications. This technology expands what is possible enabling EMC shielding, RF interconnects, 3D stacking, optical windows and more.
Learn More
Wondering what Boschman’s technologies can do for you? We would love to share more details about their systems and answer your questions.
Call Josh Markle today at 919-208-1788!
