Film Assist Molding Systems - NDC International

Fully automatic 2-strip Film Assisted Molding system
Designed for advanced mems, sensor, power, qfn and bga packages
System works with lead frames, substrates and ceramic carriers as well as individual modules
Standard equipped with Boschman’s unique and patented double Film Assisted Molding technologies
Clamping Mechanism: A highly-accurate continuously-variable, automatic clamping force mechanism from 20 to 100 tons per chase is used to enable control of mold clamping and film compression
Transfer and Cure Process Control: Servo controlled for maximum accuracy and a long service life
Data collection and process monitoring

Fully automatic 4-strip Film Assisted Molding system
Designed for advanced mems, sensor, power, qfn and bga packages
System works with lead frames, substrates and ceramic carriers as well as individual modules up to a size of 100 x 300 mm
Standard equipped with Boschman’s unique and patented double Film Assisted Molding technologies
Clamping Mechanism: A highly-accurate continuously-variable, automatic clamping force mechanism from 20 to 100 tons per chase is used to enable control of mold clamping and film compression
Transfer and Cure Process Control: Servo controlled for maximum accuracy and a long service life
Data collection and process monitoring

The most universal semi-automatic molding system designed for practically any kind of package
Works with lead frames, substrates, ceramic carriers and individual modules
Can handle standard mini-pellets, powder and liquid encapsulation materials
Comes standard with most Boschman unique and extensive Film Assisted Molding technologies
Suitable for package technology research, package development, process optimization, qualification runs and small to medium size production volumes
This system can handle test molds, 1-strip molds and 2-strip molds
High-precision press with self-correcting clamping system
Unique automatic substrate thickness compensation clamping system
Advanced transfer and cure process closed loop control
All Film Assisted Molding technologies can be processed with short conversion times
Patented Dynamic Insert Control Technology optional
Energy-efficient system design, small footprint and easy access

The most universal semi-automatic molding system designed for conventional packages
Suitable for small to medium sized production volumes
Noted for very short conversion times when moving from one package to another and low-cost tooling
This system can handle test molds, 1-strip molds and 2-strip molds
Ideal for package technology research, package development, process optimization and qualification runs
Lead frames, substrates ceramic carriers, as well as individual modules can be processed
Ergonomic design makes the system easy to operate
CE-compliant
High-precision press with self-correcting clamping system
Unique automatic substrate thickness compensation clamping system
Advanced transfer and cure process closed loop control
Energy-efficient system design, small footprint and easy access
Vacuum mold option available
Unique Automatic Substrate Thickness Compensation Clamping System optional

Automatic (single reel or dual reel) reel-to-reel multi-plunger molding system
Designed for contactless and contact smartcard modules, discrete small signal, power packages and ultra-thin tape-based packages
Offers high throughput, competitive pricing, low compound usage and high-precision mold tooling
Offers a mold length of 350 mm and very short machine time to achieve maximum productivity
Very precise pitch control for maximum accuracy in package offset and cavity depth precision
Ultra-thin endless strip handling < 60 Micron
Separate de-gate station
High-precision press with self-correcting clamping system
Advanced transfer and cure process closed loop control
Easy and fast conversion between different packages
Three mold cleaning methods
CE Certified