NDC International offers the following Solder Ball Placement systems from KOSES:
KOSES Flux Pre-Cleaning System KPM300
FEATURES
- Dual Rail Flux Pre-Cleaning System
- Multiple Function System for Cleaning: OSP Pre-Cleaning & Via Cleaning
- High Productivity
- Reliability & Quality
- Flux Dotting for OSP Removal on Bottom Ball Pad
- Provides Optimized Blade Angle
- Parameter Setting for Station Block Height Control Prevents Material Damage
- Strip Warpage Compensation
- Reliable Flux Auto Supply & Management
KOSES KAM7000F Solder Ball Attach System
FEATURES
- New Solder Ball Mounting System for Singulated Packages Handles Wide Boat Flux Dotting & Ball Attach in 1 Shot
- B.P.M. for Wide Boat is Approximately 2 Boat
- Cycle Time for 1 Boat Under 29 Sec.
- Mechanical Clamp Increases the Applicable Package Quantities in a Boat
- Package Alignment Using Mechanical Alignment Classified by Normal Package & Heat Spread Type
- Normal Package Uses Bottom Guide Concept to Achieve Accurate Alignment
- Heat Spread Uses Top Guide Concept to Achieve Accurate Alignment
- Applicable Min Ball Diameter: 0.2mm, Min Pitch: 0.4mm
- Diameter of 0.2 Ball Can Use 2-Step or 3-Step
- Vision Inspection is Optional for the Offloader (Model: KUM4000F)
KOSES KWA 970 Wafer Solder Ball Attach System
FEATURES
- Interchangeable Loader/Off Loader According to User Selection
- 6 ~ 8-inch Wafer Application
- Easy-Access Design
- Robot System Handles Wafers at 8 Points in 340 Degrees
- Soft & Precise Movement Prevents Wafer Damage
- Optional Pre-Alignment System
- Transfer Arm with Sensor to Identify the Wafer
- X, Y, θ Table Controlled by PRS Vision System
- PRS Vision System Checks Wafer Surface to Provide Wafer Aligning Data
- Flux Mask Printing System Ensures the Exact Flux Volume and Flux Position
- Individual Vacuum Control System Allows Ball Placement on the Wafer Edge Corner
- Pre-Vision and Post Vision to Verify Accuracy
